ROVAA: Offline attendance automation using a voice–OCR-based 3-DOF robotic arm with Raspberry Pi
Abstract
Conventional classroom attendance systems suffer from limitations in accuracy, hygiene, data privacy, and reliability in low-connectivity environments, whether they are manual, cloud-dependent, or single-modality systems. To address these gaps, this paper presents ROVAA, a low-cost, fully offline, AI-driven robotic attendance system in the classroom environment that uniquely integrates three complementary modalities: offline voice recognition, optical character recognition (OCR), and a 3- degrees of freedom (DOF) robotic arm controlled via inverse kinematics, an integration not demonstrated in prior work. The system operates on a Raspberry Pi 4 model B and employs the Vosk speech recognition model and Tesseract OCR for accurate offline processing. Audio and visual inputs are matched in real time to enable the arm to mark attendance at pre-calibrated positions on a touchscreen. Experimental validation under varied lighting and acoustic conditions yielded 96.2% speech recognition accuracy, 95.8% OCR accuracy, and 97.6% robotic arm precision, producing an overall system success rate of 92.8%, demonstrating that high reliability is achievable without cloud infrastructure. The system is designed for cost-effectiveness, data privacy, and scalability, making it suitable for resource-constrained environments such as rural schools and institutions with limited network access. It additionally serves as an educational platform for human–robot collaboration.
Keywords
3-DOF manipulator; Classroom attendance automation; Human robot collaboration; Optical character recognition; Robot inverse kinematics; Voice recognition
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PDFDOI: http://doi.org/10.11591/ijra.v15i3.pp561-576
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Copyright (c) 2026 Rajanikanth Kashi Nagaraj, Archana Harihara Ranganatha, Surendra Hanumanthaiah Honnamachanahalli, Venu Manighatta Gopalakrishnappa

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IAES International Journal of Robotics and Automation (IJRA)
ISSN 2089-4856, e-ISSN 2722-2586
This journal is published by the Institute of Advanced Engineering and Science (IAES) in collaboration with Intelektual Pustaka Media Utama (IPMU).